Recycle Microchip Optical Networking Product:OTN Processor,SONET/SDH and T1/E1, FTTH SoC
As a leading enterprise in the electronic components recycling industry, Shenzhen Mingjiada Electronics Co., Ltd. offers comprehensive recycling solutions through professional service, highly competitive prices and integrity in business.
Recycling Advantages:
1. Comprehensive coverage of high-end, mainstream components
Full-range recycling: covering 5G chips, new energy ICs, IoT ICs, Bluetooth ICs, in-vehicle infotainment system ICs, automotive-grade ICs, communications ICs, AI chips, memory ICs, sensor ICs, microcontroller ICs, transceiver ICs, Ethernet ICs, Wi-Fi chips, wireless communication modules, connectors and other electronic components.
2. Professional evaluation system and precise pricing
Experienced engineering team: Rapidly identifies model numbers, batch numbers, packaging types and quality through testing.
Advanced testing equipment: Utilises X-ray inspection, functional testing and data erasure technology to ensure chip integrity.
Multi-dimensional pricing model: Integrates real-time global market data, scarcity, application prospects and condition assessments to provide accurate and transparent quotations.
3. Price and Financial Advantages Facilitate Rapid Liquidation
High-value buyback: Leveraging our global market network to provide industry-leading quotes, maximising the value of your stock.
Rapid settlement: Payment completed within 24–48 hours of verification, supporting cash, wire transfers and multi-currency settlements.
Strong capital base: Ensures the smooth execution of large-scale transactions, eliminating the pressure associated with credit terms.
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Multiple collaboration options: cash purchases, consignment collection services, consignment sales, agency sales, clearance sales and inventory management.
Flexible delivery methods: customer self-collection, factory collection and global logistics tracking.
5. Comprehensive end-to-end service framework
One-stop workflow from consultation to settlement: stock categorisation → submission of stock lists → rapid assessment → quotation → logistics → quality inspection → payment → after-sales support.
Dedicated team support: providing personalised end-to-end assistance to optimise clients’ operational processes and enhance efficiency.
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I. OTN Processors (DIGI / HyPHY / META Series)
OTN processors form the core of Microchip’s optical transport product line. They are categorised into the fifth-generation DIGI series for T-bit-class backbones, the HyPHY series for metropolitan multi-service applications, and the high-density metropolitan META series. These support OTN, FlexE, FlexO and Ethernet-over-fibre transport, and are compatible with modern packet-optical transport architectures.
1. DIGI-G5 (PM6010/PM6011)
A fifth-generation OTN processor manufactured using a 16nm process, designed for cloud networks, 5G core networks and DCI (Data Centre Interconnect). It offers a maximum single-chip total bandwidth of 1.2 Tbps and provides native support for FlexE, OTUCn, and 400G/200G/100G/50G/25G/10G customer-side interfaces. SerDes supporting up to 56G PAM4; supports ODUflex flexible rate mapping, strong FEC, IEEE 1588v2 PTP synchronisation and SyncE; available in both encrypted and unencrypted versions; designed for use in transponders, muxponders, OTN switching line cards and high-capacity POTP packet-optical transport platforms; features low power consumption per port, making it suitable for high-density rack-mounted equipment.
2. HyPHY Series (PM5420 HyPHY-20G, PM5456 HyPHY-10Gflex, PM5426 HyPHY-10G)
Multi-protocol single-chip OTN SoCs, designed primarily for metropolitan and edge access-layer MSPP multi-service platforms, ROADMs and WDM equipment. They are compatible with OTN + SONET/SDH + Ethernet multi-service convergence and support VC mapping, ODU cross-connect and lower-order ODU scheduling; The PM5426 is specifically optimised for compact edge optical access platforms, supporting the hybrid carriage of both traditional TDM and packet services. It is suitable for the seamless upgrading of existing operator networks, reducing the number of chips on the board.
3. META Series (PM5442B META-120G)
A high-density metropolitan OTN solution designed for IPoDWDM and as an OTN line card for integration into carrier switches and routers. It enables high-density Ethernet + OTN aggregation and supports MPLS classification, link OAM and 1588 time distribution, making it the mainstream choice for mobile backhaul PTN and small-scale metropolitan aggregation equipment.
Common features: The entire series complies with ITU-T OTN standards and incorporates an ODU cross-connect matrix, service mapping, and alarm and performance monitoring. It is accompanied by a comprehensive SDK, reference designs and IBIS models to reduce equipment manufacturers’ development cycles; it supports direct integration with high-speed optical modules and switching chips without the need for additional gearbox chips.
II. SONET/SDH and T1/E1 Traditional TDM Service Chipsets
This series builds on the legacy PMC product lines—including the classic S/UNI, Arrow and ZL timing and synchronisation products—and is designed to carry traditional dedicated lines, base station E1/T1 trunks, SDH/SONET optical port access, and wideband/narrowband cross-connect switching. It serves as the TDM service tributary for OTN equipment, enabling interconnection between legacy and new networks, and is widely deployed in MSPP (Multi-Service Provisioning Platforms), access gateways and transmission clock synchronisation units.
1. SONET/SDH Framers, PHYs and Cross-Connect Chips
- PM5384 S/UNI‑1x155: OC‑3/STM‑1 speeds, supporting ATM and Packet over SONET/SDH; a classic low-speed optical port PHY/framer;
- PM5326 ARROW 2x192: OC‑48/OC‑192, STM‑16/STM‑64 dual-path framing and aggregation chip, total capacity 20G, high-order/low-order VC cross-connect scheduling, used in high-capacity SDH line cards;
The product range covers all speeds from OC‑3 to OC‑192, including high-order cross-connects, low-order VC cross-connects, narrowband cross-connects and single-chip ADM (Add-Drop Multiplexer) devices, supporting channelised service isolation, channel alarms and cascaded services.
2. T1/E1 framers, Line Interface Units (LIUs) and timing synchronisation chips
- T1/E1 LIUs and framers: provide DS1/E1 physical layer transmission and reception, line equalisation, B8ZS/HDB3 encoding and decoding, frame synchronisation and error detection, with support for 1+1 line protection;
- ZL30109, ZL30106, ZL30132 DPLL digital phase-locked loop synchronisers: specifically designed for SONET/SDH, T1/E1, E1 trunking, compatible with GR-1244 and ITU-T G.823, supporting clock recovery from service streams, synchronous Ethernet and PTP time injection; these are standard components for transport network clock boards;
When integrated with the SSU2000 synchronisation supply unit as a complete system solution, they can scale to provide over a thousand redundant T1/E1 clock outputs, meeting the requirements for operators’ synchronous network deployment.
Core Value: On an all-IP OTN platform, it enables seamless integration of traditional 2M dedicated lines, base station E1 and financial TDM dedicated lines, thereby protecting operators’ existing service investments; it is an indispensable branch chip for hybrid service transmission equipment.
III. FTTH (Fibre to the Home) PON System-on-Chip (SoC)
Microchip’s FTTH SoC provides an end-to-end interoperable PON broadband access solution, covering mainstream passive optical network protocols such as GPON and XGS-PON. It comprises two types of SoC—OLT (Office Line Terminal) and ONU (Optical Network Unit)—and is designed for home gateways, MDU (Multi-Dwelling Unit) fibre access platforms. They integrate a PON MAC, high-speed PHY, embedded processor, switching engine and synchronised OAM module, and support operator broadband software stacks such as RDK-B and prplOS.
- Protocol compatibility: Supports ITU-T GPON and XGS-PON symmetrical 10G PON; supports DBA (Dynamic Bandwidth Allocation), OMCI (Remote Management), FEC (Forward Error Correction) and PON link OAM;
- Integrated architecture: Single-chip integration of PON MAC, SERDES, Ethernet switching and CPU subsystems; certain models also integrate VoIP, USB and high-speed peripheral interfaces, reducing the peripheral BOM;
- Application scenarios: Residential optical network units (ONUs), multi-user access boxes (MDUs) for residential estates, and small-scale edge OLTs; designed for broadband fibre deployments in telecoms and broadcasting sectors, supporting concurrent multi-service operations (internet access, IPTV, voice);
- Supporting tools: Provides the OMCI protocol stack, drivers and reference hardware designs; supports operator certification and commissioning; features carrier-grade disconnection protection and link fault diagnosis capabilities.
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